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 当前位置：首页 >集成电路测试封装设备 |
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- Up to 70 Trays per hour.
- Flexibility for all JEDEC and EIAJ trays (Thick and Thin tray type).
- Designed Specifically for full tray flaming.
- Intelligent Auto flame detector.
- Package inspection capability at post mark station can be easily incorporated
- Operator interface, complete utilization of Window NT
- Process diagnostics capability
- Automatic precise clamper mechanism for devices alignment
- Optional:-
- “Top-up” reject management.
- Automatic Pad cleaning.
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| TUBE TO TUBE 激光打标机 |
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- Tubes / TESEC Tray Handling of Singulated Packages.
- Applicable Packages Include SOIC, SSOP, TSSOP, PDIP, CERDIP, TO220, DPAK, etc.
- Dual Track Mechanism.
- Orientation Check, 3D Lead Inspection.
- Laser Marking.
- Optional Post Marking Vision Checking.
- Auto Sort Reject Unit.
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- Manipulator Used For Easily Attach Different Tester Head To Handler.
- Loads Up To 500 KG And For Handler And Wafer Prober Docking.
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Design and fabricate test sockets for high performance applications onto a smaller socket footprint (35mm sq) with pitch requirements of 0.5mm to 1.27mm. Our solution supports the growing market needs for fine-pitch with high performance in a smaller footprint has resulted in better space and cost-saving against other test socket. |
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- Test Handler Change Kit.
- Test Socket, Handler Track, Docking System Design.
- Design and manufacture of Jigs & Fixtures.
- Precision Parts Machining.
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| 设计制造半导体设备
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低成本集成电路（In Tray）激光标识系统，包括可选的视像检测系统；
Lead Frame, Substrate的激光标识，包括可选的视像检测系统；
BGA Substrate Test Handler，全新的测试概念，可成倍提高测试效率，特别适合小封装尺寸的BGA Substrate测试；
低成本Lead Frame, Substrate 的自动上下料设备，可以和各种不同类型的测试封装设备接口，从而降低其它设备购置成本；
Tray To Tape & Reel中间转换设备。
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