Material Specification
Package type : Plastic IC devices
Package size : 1.5 x 1.5 to 5.0 x 5.5 mm
Configuration : BGA / QFN
Input/Output Configuration
Input : Waffle Pack Trays/Carrier Tape
Output : Tape & Reel/ Rejects to bins
Machine Performance
Machine UPH ~ 2000
MTBA > 1 hour
MTBF > 168 hours
MTTR < 1 hour
MTTA < 5 mins
System down time = < 2%
Conversion time = < 30 minutes (For standard
Tape or Trays)
Footprint
1200mm x 850mm x 1580mm (L x W x H)
( Including tower light height is 1800mm)
System Control
PC Based Control with Windows NT Platform
Chassis : 19” Industrial PC
Monitor : 15” LCD Flat Screen
Keyboard : Standard
Mouse : Standard
Printer : Optional
User Friendly Graphics User Interface(GUI)Production
lot, SPC data & Vision reporting possible
Optional features :SECS II / GEMS; Host Link capability
